PCB Layout & High-Speed Design

High-speed layout is where a design either becomes manufacturable or becomes a series of expensive respins. The difference is rarely one dramatic mistake — it is an accumulation of small compromises in the stack-up, the return paths and the placement.

Placement is most of the work

Before a single track is routed we settle placement: power stages away from sensitive analog, crystals close and quiet, connectors where the mechanics need them, and decoupling on the same side as the pin it serves. A board that places well routes quickly. A board that places badly never routes cleanly at any effort.

The stack-up is a decision, not a default

We agree the build with your fabricator first — dielectric materials, copper weights, prepreg and core thicknesses — and calculate impedance against that specific build. A four-layer board with an honest stack-up outperforms a six-layer board with an assumed one.

Signal and power integrity, quantified

Interfaces are routed to their published budgets and then verified: impedance profiles, crosstalk between aggressor and victim pairs, eye diagrams where the data rate warrants simulation, and a power delivery network checked against target impedance across frequency. DC drop is simulated so a 1.0 V core rail arrives as 1.0 V.

EMC designed in, not chased later

Continuous reference planes, controlled loop areas, filtered and guarded I/O, deliberate chassis-ground strategy and a shielding plan agreed with mechanical. Boards that follow these rules routinely pass radiated emissions on the first visit to the chamber — which is the single largest schedule risk we can remove for you.