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Anode

About Anode

Lets Dive In

Twelve years of electronics design under one roof - the people, the standards we hold ourselves to, and the bench the numbers come from.

How we got here

The company started in 2014 with two engineers, a reflow oven and a conviction that the handover between hardware and firmware was where most product schedules quietly died. Doing both under one roof was not a business plan so much as an irritation with how the alternative worked.

Twelve years later that is still the organising idea. Fourteen engineers cover analog and power, high-speed and HDI layout, embedded firmware, test and manufacturing transfer — and they sit close enough that a routing decision and a peripheral assignment get made in the same conversation.

We are deliberately not a body shop. We take a bounded number of projects, we write down what we measured, and we hand over source files rather than dependencies.

  • 340+

    Boards laid out

  • 14

    Engineers on the team

  • 23

    Countries shipped to

Why Anode

What we hold ourselves to.

Four claims, each stated as something you could check rather than something you have to take on trust.

  • We tell you what we measured

    Every claim in a report traces to a number from a bench.

    Efficiency curves, noise floors, thermal images and current traces are delivered as data, not adjectives. Where margin is thin we say so rather than averaging it away.

  • Hardware and firmware in one team

    Test points land where debug actually needs them.

    Because the same engineers lay out the board and write the bring-up firmware, pin assignments respect the routing and the peripheral matrix at the same time — and bring-up starts the day boards arrive.

  • Documentation is a deliverable

    You receive source files, not a PDF and a dependency on us.

    Altium or KiCad projects, firmware repositories, build systems, test procedures and an issue register with every finding, its root cause and its disposition.

  • Secure

    First-time EMC pass rate across the last 24 projects: 21 of 24.

    Pre-compliance probing happens on the first prototype, while the layout can still change. The three that failed did so on findings we had already flagged as accepted risks.

The team

Who you will actually work with.

No account-management layer — the engineer you brief is the engineer holding the soldering iron.

  • Nirosh Lakshan

    Nirosh Lakshan

    Electronic Engineer

    Electronic and Telecommunication Engineering Undergraduate

    Check out on LinkedIn

Lab & facilities

What is on the bench.

Everything below is in the building. Pre-compliance, thermal and power characterisation happen the week a board arrives, not the month a test house has a slot.

Measurement

  • 4-channel 500 MHz oscilloscopes

    ×3, with differential and current probes

  • Precision current analysers

    nA to A, for duty-cycle power profiling

  • Spectrum analyser, 9 kHz – 3 GHz

    With LISN for conducted emissions

  • Vector network analyser

    Impedance and return-loss verification

  • Programmable DC loads and supplies

    Efficiency sweeps across line and load

EMC & immunity

  • Near-field probe set

    H and E field, 30 MHz – 3 GHz

  • ESD simulator

    IEC 61000-4-2, contact and air to ±15 kV

  • EFT / surge generator

    IEC 61000-4-4 and 61000-4-5

  • TEM cell

    Repeatable radiated pre-compliance on small assemblies

Environmental

  • Thermal chamber

    −40 °C to +125 °C, programmable profiles

  • Humidity chamber

    10–95 % RH, condensation cycling

  • Vibration table

    Sine and random to IEC 60068-2

  • Thermal imaging camera

    Component-level hotspot analysis under load

Build & rework

  • Reflow oven and stencil printer

    Prototype builds and process trials

  • Hot-air and IR rework

    Down to 0201 passives and BGA reball

  • Digital inspection microscope

    IPC-A-610 Class 2 and Class 3 inspection

  • FDM and SLA 3D printing

    Enclosure fit checks and test fixtures

Accredited

Certified where it matters.

  • ISO 9001:2015

    BSI

    Quality management system covering design, verification and handover.

  • ISO 13485:2016

    BSI

    Medical device design controls, applied to our medical electronics work.

  • IPC-A-610 CIS

    IPC

    Certified IPC Specialists on staff for Class 2 and Class 3 workmanship.

  • IPC CID+

    IPC

    Advanced Certified Interconnect Designers leading our layout team.

Have a board that needs designing?

Send us the constraints — schematic, mechanical envelope, volume, timeline. You will get a considered response from an engineer within one business day, not a brochure.

Request a QuoteTalk to an engineer

We reply within one business day, from an engineer.